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SALMUT Ceramic Material High Thermal Conductivity Silicon Nitride AMB Copper Clad Sheet

Product Details

Place of Origin: China

Brand Name: SALMUT

Payment & Shipping Terms

Minimum Order Quantity: 25mts

Price: negotiable

Packaging Details: Wooden box packaging.

Delivery Time: 20 working days

Payment Terms: L/C, D/P, T/T

Supply Ability: Annual production of over 15 million pieces

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Highlight:

Ceramic Material High Thermal Conductivity

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Copper Clad Sheet Ceramic Material

Effective Size:
127 * 178mm
Appearance:
Copper Clad Laminate (Graphic Customization)
Ceramic Plate Thickness:
0.32mm
Name:
High Thermal Conductivity Silicon Nitride AMB Copper Clad Sheet
Copper Thickness:
0.8mm And Below
Peel Strength:
10N/mm
Effective Size:
127 * 178mm
Appearance:
Copper Clad Laminate (Graphic Customization)
Ceramic Plate Thickness:
0.32mm
Name:
High Thermal Conductivity Silicon Nitride AMB Copper Clad Sheet
Copper Thickness:
0.8mm And Below
Peel Strength:
10N/mm
SALMUT Ceramic Material High Thermal Conductivity Silicon Nitride AMB Copper Clad Sheet

High thermal conductivity silicon nitride AMB Copper Clad Sheet

 

Silicon nitride ceramic is an inorganic material ceramic that does not shrink during sintering. Silicon nitride has high strength, especially hot pressed silicon nitride, which is one of the hardest substances in the world. It has properties such as high strength, low density, and high temperature resistance.

Characteristic

Thermal shock: -50 to 175 degrees Celsius, hot and cold 3000 cycles of impact;

Void rate: below 1%;

Lithography graphics: The graphic size is customized according to customer requirements

Protective layer: Production of protective layer by electroplating or chemical plating according to customer requirements

SALMUT Ceramic Material High Thermal Conductivity Silicon Nitride AMB Copper Clad Sheet 0